Semiconductors

The Download: China’s brain implant ambitions

This is today’s edition of The Download, our weekday newsletter that provides a daily dose of what’s going on in the world...

China has approved the world’s first invasive brain-computer chip—here’s what’s next

One day last October, sitting in the courtyard of his house in China’s Henan province, Dong Hui decided to see if he could hold a pen to...

Microsoft unveils Project Solara AI, a chip-to-cloud platform built to power a new generation of 'agent-first' enterprise devices — hardware designed to run AI agents instead of traditional apps

Microsoft has unveiled Project Solara, an Android-based chip-to-cloud platform for AI-first enterprise devices. The system combines...

World-first spintronic p-bit on silicon chip points toward larger AI-ready p-computers

A Japan–U.S. collaborative research team has demonstrated the world's first integrated spintronic probabilistic bit, or p-bit,...

Taiwan Minister Emphasizes Collaboration and Future Focus on Photonics, WBG, and Quantum

NSTC Minister Wu shares Taiwan's four-pillar shift from chipmaker to AI enabler. The post Taiwan Minister Emphasizes Collaboration and...

Synopsys and Samsung Foundry Expand AI-Driven Design, Test, and 3DIC Enablement for Advanced Nodes

Expanded collaboration delivers AI-powered EDA, test, IP, and 3DIC solutions for advanced semiconductor designs. The post Synopsys and...

Physical AI Pushes Chipmakers Up the Value Chain

At the TSMC European Symposium, European semiconductor CEOs spoke about how AI in influencing business. The post Physical AI Pushes...

TSMC Defends Transistor Scaling Amid Huawei’s ‘Her’s Law’ Proposal

Kevin Zhang said 3D integration is important, but transistor scaling remains the semiconductor industry's primary driver of performance...

Nikon Leveraging ArF Scanner Price to Challenge ASML

The Japanese litho firm is lowering the price of its ArF tools while also launching a brand-new immersion platform by 2028. The post...

EHang VT35

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Diamond V.MO

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Tom's Hardware Unfiltered: Computex 2026, Day 2 — Interviews, roundtables, and the first day at the Nanggang Exhibition Center

As Computex 2026 fully kicks off, our team finally enters the halls of the Nanggang Exhibition Center in Taipei in the latest in our...

Optoelectronics and Magnetic properties calculation of RE2MnNiO6 (RE=La-Lu,Y) using Density Functional Theory

arXiv:2606.02760v1 Announce Type: new Abstract: RE2NiMnO6 (RE = La-Lu) family of ordered double-perovskite oxides hosts a corner-sharing...

Predicting core-level X-ray photoemission spectra of oxide surfaces from first principles -- a case study for SnO$_2$

arXiv:2606.03853v1 Announce Type: new Abstract: X-ray photoemission spectroscopy (XPS) is a powerful technique to gain insight into the...

Topological Weyl Phase of an Ideal Spin-Gapless Semiconductor KCrSe

arXiv:2606.03959v1 Announce Type: new Abstract: The coexistence of topological and spin-polarized electronic states within a single...

Microsoft reveals new quantum chip made with AI, says it will have systems by 2029

Microsoft unveiled a new chip called Majorana 2, a follow-on from its first Majorana chip last year

Marvell shares touch record high after Nvidia's Huang calls it 'next trillion-dollar company'

Marvell Technology shares saw a significant jump of over 25%. This surge followed Nvidia CEO Jensen Huang's prediction that Marvell...

Chipmaker SK Hynix to double wafer capacity in 5 years to meet AI demand

Intel CEO praises 'friend' Nvidia and TSMC despite rising competition

SK Hynix ascends as new memory king with high-bandwidth AI chips

Applied Materials looks to hire 25% more chip talent in Southeast Asia

US arms sales pause would push Taiwan toward asymmetric-defense tech: Analysts

The idea of Trump using arms sales as a negotiating chip with China has sparked concerns that Washington might decline procurement deals...

Zero Gravity ZG-T6

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SG Enviro closes Series A, targets water- and energy-hungry data centres and fabs in SEA

SG Enviro, a Singapore-headquartered industrial water and wastewater engineering firm, has closed a Series A round led by Emerald...

Counterfeit G.Skill and V-Color DDR5 modules hit Chinese marketplaces, impacting company sales — cheap contraband memory using identical PCBs and heat spreaders almost impossible to spot

Counterfeit memory modules with G.Skill and V-Color badges sold at Chinese marketplaces use identical PCBs and heat spreaders, are hard...

Chipsea Technology Rides the AI PC Wave with Next-Gen EC Chips

The trillion-dollar AI PC market is reshaping the global semiconductor landscape, and one Chinese chipmaker is quietly positioning...

Intel's 5.7 GHz Xeon 6377P features 12 P-cores and a desktop-class LGA1700 socket — unusual server CPU prioritizes clock speed over core count

Intel has unveiled the Xeon 6377P, a 12-core Bartlett Lake server processor featuring a 5.7 GHz boost clock, ECC support, and a 95W TDP....

The future of India’s chip industry

A new NITI Aayog report says India’s semiconductor ecosystem is not yet equipped to fully meet domestic demand, while stressing the need...

CARVE: Certified Affordable Repair of Vetoed Maneuvers via Envelopes for Interactive Driving

arXiv:2606.02641v1 Announce Type: new Abstract: Interactive driving exposes a failure mode that is easy to miss in rule-aware...

Observation of residual entanglement in chip-based entanglement purification

arXiv:2606.03343v1 Announce Type: new Abstract: Entanglement purification is an essential component of quantum repeaters, as it can...

PRISM: Photonics-Informed Inverse Lithography for Manufacturable Inverse-Designed Photonic Integrated Circuits

arXiv:2602.15762v2 Announce Type: replace-cross Abstract: Recent advances in photonic inverse design have demonstrated the ability to...

AlN Gate Interlayer for UWBG AlGaN Transistors with Breakdown Field >6.9 MV/cm and PFOM >1.8 GW/cm2

arXiv:2606.02954v1 Announce Type: new Abstract: We report the demonstration of regrown epitaxial AlN gate interlayers with ultra-wide...

High-Throughput Discovery of Semimetallic Borophenes with Diverse Dirac States Via Transferable Tight-Binding Approach

arXiv:2606.03060v1 Announce Type: new Abstract: Borophene has attracted extensive interest due to its structural flexibility and...

Magneto-optical evidence for single-crystal-like magnetic switching of epitaxial antiferromagnetic LaFeO3 films

arXiv:2606.03286v1 Announce Type: new Abstract: Strained epitaxial films of the antiferromagnetic orthoferrite LaFeO3 offer a promising...

Unconventional crystallization pathway bypassing the intermediate cubic phase in phase-change superlattices

arXiv:2606.03309v1 Announce Type: new Abstract: The Ge-Sb-Te (GST) superlattice phase-change material is a promising candidate for...

Role of Characteristic Length Scale in Interface Graphitization-Induced Wear Resistance of Diamond and Amorphous Carbon

arXiv:2606.03325v1 Announce Type: new Abstract: The evolution of interfacial atomic structures critically influences the friction and...

Microscopic derivation of the microstretch theory for carbon nanotubes

arXiv:2606.03452v1 Announce Type: new Abstract: Twisted carbon nanotubes support phonons involving not only torsion, naturally...

Molecular neutron spectroscopy techniques applied to ceramics $\alpha$-SiC and $\beta$-Ga$_2$O$_3$

arXiv:2606.03586v1 Announce Type: new Abstract: Neutron spectroscopy is a powerful technique for determining the vibrational states of...

RamanGPT: Bidirectional Mapping Between Crystal Structures and Raman Spectra with Graph Neural Networks and Generative Transformers

arXiv:2606.03764v1 Announce Type: new Abstract: Raman spectroscopy is one of the most accessible vibrational probes in materials...

Fracture energy of 6H-SiC at the microscale: effects of testing geometry and notch preparation

arXiv:2606.03818v1 Announce Type: new Abstract: Micromechanical testing enables small-scale fracture energy measurements, but values...